• DocumentCode
    1290125
  • Title

    Modeling the effect of hot lots in semiconductor manufacturing systems

  • Author

    Narahari, Y.

  • Author_Institution
    Dept. of Comput. Sci. & Autom., Indian Inst. of Sci., Bangalore
  • Volume
    10
  • Issue
    1
  • fYear
    1997
  • fDate
    2/1/1997 12:00:00 AM
  • Firstpage
    185
  • Lastpage
    188
  • Abstract
    The presence of hot lots or high-priority jobs in semiconductor manufacturing systems is known to significantly affect the cycle time and throughput of the regular lots since the hot lots get priority at all stages of processing. In this paper, we present an efficient analytical model based on re-entrant lines and use an efficient, approximate analysis methodology for this model in order to predict the performance of a semiconductor manufacturing line in the presence of hot lots. The proposed method explicitly models scheduling policies and can be used for rapid performance analysis. Using the analytical method and also simulation, we analyze two re-entrant lines, including a full-scale model of a wafer fab, under various buffer priority scheduling policies. The numerical results show the severe effects hot lots can have on the performance characteristics of regular lots
  • Keywords
    approximation theory; integrated circuit manufacture; modelling; production control; production engineering computing; semiconductor device manufacture; analytical model; approximate analysis methodology; buffer priority scheduling policies; cycle time; high-priority jobs; hot lots; rapid performance analysis; re-entrant lines; scheduling policies; semiconductor manufacturing line performance; semiconductor manufacturing systems; throughput; wafer fab model; Analytical models; Job shop scheduling; Manufacturing systems; Performance analysis; Predictive models; Pulp manufacturing; Semiconductor device manufacture; Semiconductor device modeling; Throughput; Virtual manufacturing;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.554507
  • Filename
    554507