• DocumentCode
    129188
  • Title

    Temperature distribution of piezoelectric transformer with heat couple component using finite element method

  • Author

    Weiwei Shao ; Zhile Han ; Yongjia Xiang ; Peiyang Li ; Yaoyao Cui

  • Author_Institution
    Dept. of Med. Ultrasound, Suzhou Inst. of Biomed. Eng. & Technol., Suzhou, China
  • fYear
    2014
  • fDate
    3-6 Sept. 2014
  • Firstpage
    1340
  • Lastpage
    1343
  • Abstract
    The temperature field of a piezoelectric transformer with heat couple component are analyzed at steady state conditions in this paper. The contour extensional vibration mode of the transformer is determined by impedance simulation analysis and experiment result. Mechanical vibration losses, piezoelectric losses, dielectric losses are considered for a piezoelectric transformer. In order to verify the calculated temperature results, the piezoelectric transformer ´s temperature distributions were measured by the infrared thermometry. The experiment results show a good uniformity with the calculation results. For the piezoelectric transformer with heat couple component, friction heat were considered as another heat source of temperature distribution. The temperature distribution results show the heat couple component depresses temperature gradient of the piezoelectric transformer and improves piezoelectric material utilization rate effectively.
  • Keywords
    dielectric losses; finite element analysis; piezoelectric devices; temperature distribution; temperature measurement; transformers; vibrations; contour extensional vibration mode; dielectric losses; finite element method; friction heat; heat couple component; impedance simulation analysis; infrared thermometry; mechanical vibration losses; piezoelectric losses; piezoelectric material utilization rate; piezoelectric transformer; temperature distribution; temperature gradient; Couplings; Dielectric losses; Heating; Temperature measurement; Piezoelectric transformer; finite element simulation; heat couple component; temperature distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2014 IEEE International
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2014.0331
  • Filename
    6931832