• DocumentCode
    1292369
  • Title

    Circuitry in three dimensions: multifunctional molded plastic packages

  • Author

    Frisch, David C.

  • Author_Institution
    Mitsui-Pathtek Corp., Rochester, NY, USA
  • Volume
    27
  • Issue
    3
  • fYear
    1991
  • Firstpage
    442
  • Lastpage
    446
  • Abstract
    The topics dealt with are: some of the major structural/mechanical benefits of a molded circuit board; some of the material benefits of a molded circuit board; high-heat thermoplastics; resin materials for molded circuit interconnect fabrication; MCB metallization; MCB general properties; molded circuit interconnect applications; and the future of performance plastics and 3D molded circuit interconnects. Molded circuits consolidate circuitry, wiring and hardware into a one piece construction. The resultant integral assembly provides increased reliability and reduced costs. Elements of cost savings include reduced factory labor, parts consolidations, simplified product assembly, lighter weight, compact size, and unique function
  • Keywords
    packaging; plastics; polymers; printed circuits; wiring; 3D; circuit interconnect fabrication; costs; integral assembly; material; metallization; molded circuit board; packages; performance; reliability; resin; thermoplastics; wiring; Assembly; Fabrication; Inorganic materials; Integrated circuit interconnections; Mechanical factors; Metallization; Plastics; Printed circuits; Resins; Wiring;
  • fLanguage
    English
  • Journal_Title
    Industry Applications, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-9994
  • Type

    jour

  • DOI
    10.1109/28.81824
  • Filename
    81824