• DocumentCode
    1293555
  • Title

    Fabrication of silicide structures by silicide direct-write electron-beam lithography process (SiDWEL) on thin silicon nitride membranes and on tantalum substrates

  • Author

    Lavallee, E. ; Beavais, J. ; Drouin, D. ; Beerens, J. ; Morris, D. ; Chaker, M.

  • Author_Institution
    Dept. de Genie Electr. et de Genie Inf., Sherbrooke Univ., Que., Canada
  • Volume
    35
  • Issue
    23
  • fYear
    1999
  • fDate
    11/11/1999 12:00:00 AM
  • Firstpage
    2027
  • Lastpage
    2028
  • Abstract
    To achieve optimal resolution for microelectronic devices and nanostructures fabrication, a study has been carried out into the use of the silicide direct-write electron-beam lithography process (SiDWEL) for silicon nitride membranes and thick tantalum layers. Results demonstrate that the threshold doses and resolution of the SiDWEL lithography technique are substrate-independent
  • Keywords
    electron beam lithography; metallisation; nanotechnology; SiN; Ta; microelectronic device; nanostructure fabrication; silicide direct write electron beam lithography; silicon nitride membrane; tantalum substrate;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19991394
  • Filename
    819039