DocumentCode
1293774
Title
On the role of energy deposition in triggering SEGR in power MOSFETs
Author
Selva, Luis E. ; Swift, Gary M. ; Taylor, William A. ; Edmonds, Larry D.
Author_Institution
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
Volume
46
Issue
6
fYear
1999
Firstpage
1403
Lastpage
1409
Abstract
Single event gate rupture (SEGR) was studied using three types of power MOSFET devices with ions having incident linear energy transfers (LETs) in silicon from 26 to 82 MeV/spl middot/cm/sup 2//mg. Results are: (1) consistent with Wrobel´s oxide breakdown for V/sub DS/=0 volts (for both normal incidence and angle); and (2) when V/sub GS/=0 volts, energy deposited near the Si/SiO/sub 2/ interface is more important than the energy deposited deeper in the epi.
Keywords
ion beam effects; power MOSFET; semiconductor device breakdown; semiconductor device reliability; SEGR; Si-SiO/sub 2/; Wrobel´s oxide breakdown; energetic heavy ions; energy deposition; incident linear energy transfers; power MOSFETs; single event gate rupture; Dielectric substrates; Electric breakdown; Epitaxial layers; Laboratories; MOSFETs; Propulsion; Silicon; Space technology; Testing; Voltage;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/23.819099
Filename
819099
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