DocumentCode
129483
Title
mDTM: Multi-objective dynamic thermal management for on-chip systems
Author
Khdr, Heba ; Ebi, Thomas ; Shafique, Muhammad ; Amrouch, Hussam ; Karlsruhe, Jorg Henkel
Author_Institution
Dept. for Embedded Syst., Inst. of Technol. (KIT), Karlsruhe, Germany
fYear
2014
fDate
24-28 March 2014
Firstpage
1
Lastpage
6
Abstract
Thermal hot spots and unbalanced temperatures between cores on chip can cause either degradation in performance or may have a severe impact on reliability, or both. In this paper, we propose mDTM, a proactive dynamic thermal management technique for on-chip systems. It employs multi-objective management for migrating tasks in order to both prevent the system from hitting an undesirable thermal threshold and to balance the temperatures between the cores. Our evaluation on the Intel SCC platform shows that mDTM can successfully avoid a given thermal threshold and reduce spatial thermal variation by 22%. Compared to state-of-the-art, our mDTM achieves up to 58% performance gain. Additionally, we deploy an FPGA and IR camera based setup to analyze the effectiveness of our technique.
Keywords
integrated circuit reliability; thermal management (packaging); FPGA; IR camera; Intel SCC platform; mDTM; multiobjective dynamic thermal management technique; on-chip systems; reliability; spatial thermal variation reduction; thermal hot spots; thermal threshold; History; Member and Geographic Activities Board committees; System-on-chip; Temperature; Temperature measurement; Temperature sensors; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation and Test in Europe Conference and Exhibition (DATE), 2014
Conference_Location
Dresden
Type
conf
DOI
10.7873/DATE.2014.343
Filename
6800544
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