Design, fabrication and actuation of four-axis thermal actuating image stabiliser

Presented is a microelectromechanical system-based thermal actuating image stabiliser. The proposed stage has dimensions of 14.9×14.9×0.2×mm³ and contains a four-axis decoupling XY stage used for anti-shaking. The processes used to fabricate the stabiliser include silicon on isolator process, inductively coupled plasma process and flip-chip bonding technique. The maximum actuating distance of the stage is larger than 25 m, which is sufficient to resolve the shaking problem in 3 optical zoom condition. According to the experiment results, the supplied voltage for the 25 m moving distance is lower than 20 V, and the dynamic resonant frequency of the actuating device is 4.7 kHz.