Title :
Hybrid Partitioned SRAM-Based Ternary Content Addressable Memory
Author :
Ullah, Zahid ; Ilgon, Kim ; Baeg, Sanghyeon
Author_Institution :
Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon Tong, China
Abstract :
Although content addressable memory (CAM) provides fast search operation; however, CAM has disadvantages like low bit density and high cost per bit. This paper presents a novel memory architecture called hybrid partitioned static random access memory-based ternary content addressable memory (HP SRAM-based TCAM), which emulates TCAM functionality with conventional SRAM, thereby eliminating the inherited disadvantages of conventional TCAMs. HP SRAM-based TCAM logically dissects conventional TCAM table in a hybrid way (column-wise and row-wise) into TCAM sub-tables, which are then processed to be mapped to their corresponding SRAM memory units. Search operation in HP SRAM-based TCAM involves two SRAM accesses followed by a logical ANDing operation. To validate and justify our approach, 512 × 36 HP SRAM-based TCAM has been implemented in Xilinx Virtex-5 field programmable gate array (FPGA) and designed using 65-nm CMOS technology. Implementation in FPGA is advantageous and a beauty of our proposed TCAM because classical TCAMs cannot be implemented in FPGA. After a thorough analysis, we have concluded that energy/bit/search of the proposed TCAM is 85.72 fJ.
Keywords :
CMOS memory circuits; SRAM chips; content-addressable storage; field programmable gate arrays; CMOS technology; FPGA; HP SRAM-based TCAM; SRAM memory units; TCAM subtables; Xilinx Virtex-5 field programmable gate array; hybrid partitioned SRAM-based ternary content addressable memory; hybrid partitioned static random access memory-based ternary content addressable memory; memory architecture; size 65 nm; Associative memory; Computer aided manufacturing; Field programmable gate arrays; Memory management; Power demand; Random access memory; ANDing operation; APT; APTAG; BPT; SRAM; TCAM; hybrid partition;
Journal_Title :
Circuits and Systems I: Regular Papers, IEEE Transactions on
DOI :
10.1109/TCSI.2012.2215736