Title :
Simple compact diode-laser/microlens packaging
Author :
Liau, Z.L. ; Tsang, D.Z. ; Walpole, J.N.
Author_Institution :
Lincoln Lab., MIT, Lexington, MA, USA
fDate :
3/1/1997 12:00:00 AM
Abstract :
A technique has been demonstrated in which the precisely polished substrate of a microlens is directly attached to the front face of a diode laser and heatsink to form a compact stable package. An experimental package using mass-transported GaP spherical microlenses and InGaAs-AlGaAs ridge-waveguide lasers (0.98-μm wavelength) showed a well-collimated beam with a near diffraction-limited 0.7° divergence. The high-index microlens and the favorable lens configuration showed high tolerance for alignment errors in the optical-path-difference and Strehl-ratio calculations
Keywords :
III-V semiconductors; gallium arsenide; gallium compounds; heat sinks; indium compounds; infrared sources; integrated optics; laser beams; laser transitions; lenses; light diffraction; measurement errors; optical collimators; ridge waveguides; semiconductor device packaging; semiconductor lasers; substrates; waveguide lasers; 0.98 mum; GaP; InGaAs-AlGaAs; InGaAs-AlGaAs ridge-waveguide lasers; Strehl-ratio calculations; alignment errors; compact stable package; diode laser; directly attached; experimental package; favorable lens configuration; front face; high tolerance; high-index microlens; mass-transported GaP spherical microlenses; microlens; near diffraction-limited divergence; optical-path-difference; precisely polished substrate; simple compact diode-laser/microlens packaging; well-collimated beam; Chemical lasers; Diode lasers; Laboratories; Laser beam cutting; Laser beams; Lenses; Microoptics; Optical arrays; Packaging; Semiconductor laser arrays;
Journal_Title :
Quantum Electronics, IEEE Journal of
