DocumentCode :
1311349
Title :
Copper lead frame: an ultimate solution to the reliability of BLP package
Author :
Choi, Kwang-Seong ; Kang, Teck-Gyu ; Park, Ik-Seong ; Lee, Jong-Hyun ; Cha, Ki-Bon
Author_Institution :
Memory R&D Div, Hyundai Electron. Ind. Co. Ltd., Kyoungki, South Korea
Volume :
23
Issue :
1
fYear :
2000
fDate :
1/1/2000 12:00:00 AM
Firstpage :
32
Lastpage :
38
Abstract :
Copper lead frame was chosen as an on-board reliability enhancement for the BLP (bottom leaded plastic) package. Adopting the copper lead frame needed a verification process for the package reliability because of its high affinity with oxygen that degrades package reliability. A series of tests were performed to select the best copper material and to determine the adhesion index parameter. The experimental results showed that the adhesion strength between the copper lead frame and EMC (epoxy molding compound) was affected by alloy composition, oxide layer thickness, and cupric/cuprous oxide ratio, Among them, the adhesion index parameter proved to be the cupric/cuprous oxide ratio. When it falls between 0.2-0.3, the highest adhesion strength was obtained regardless of alloy composition and oxide thickness. From the adhesion test results, the Cr-Zr-Cu copper alloy was employed as the lead frame for the 54-pin BLP package. The package reliability and on-board reliability tests including surface mountability, mechanical robustness, and solder joint reliability were carried out to compare the 54-pin BLP package, with Cr-Zr copper alloy and alloy 42 lead frame
Keywords :
adhesion; copper alloys; failure analysis; mechanical strength; plastic packaging; reliability; soldering; BLP package reliability; Cr-Zr copper alloy; Cr-Zr-Cu; Cu lead frame; adhesion index parameter; adhesion strength; adhesion test; alloy composition; bottom leaded plastic package; cupric/cuprous oxide ratio; epoxy molding compound; mechanical robustness; on-board reliability enhancement; oxide layer thickness; solder joint reliability; surface mountability; Adhesives; Copper alloys; Degradation; Electromagnetic compatibility; Lead compounds; Materials testing; Performance evaluation; Plastic packaging; Robustness; Soldering;
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/6104.827524
Filename :
827524
Link To Document :
بازگشت