Title :
A Novel Method to Guarantee the Specified Thickness and Surface Roughness of the Roll-to-Roll Printed Patterns Using the Tension of a Moving Substrate
Author :
Lee, Changwoo ; Kang, Hyunkyoo ; Kim, Changwan ; Shin, Keehyun
Author_Institution :
Flexible Display Roll to Roll Res. Center, Konkuk Univ., Seoul, South Korea
Abstract :
Roll-to-roll (R2R) continuous printing is an attractive technology for mass-producing flexible printed electronics. Many studies have been conducted in this field. The application of the R2R printing process, however, requires information pertaining to system parameters such as substrate flexibility, ink formulation, and printing method as well as the curing method for conductive ink. We show that the quality of a printed pattern (thickness and surface roughness) could be affected by tension variation of the flexible bare substrate in spite of the optimal settings of the ink, substrate, and printing method. In addition, an ink-transfer mechanism for the R2R printed electronics is analyzed to reveal the relationships between the dynamic surface roughness and tension of a moving web. Since the dynamics of the physical problem are complex, simple meta models using a design of experiment are developed. The experimental results are found to be in agreement with the meta models. It is found that the two important factors for achieving the desired thickness and surface roughness of the R2R printed patterns are optimal tension and control accuracy of the operating tension.
Keywords :
curing; flexible electronics; ink; printing; substrates; surface roughness; R2R continuous printing process; R2R printed electronics; conductive ink formulation; curing method; flexible bare substrate; flexible printed electronics; meta models; moving substrate tension; roll-to-roll continuous printing; substrate flexibility; surface roughness; tension variation; Heating; Ink; Printing; Rough surfaces; Substrates; Surface roughness; Surface treatment; Ink-transfer mechanism; matching correlation; roll-to-roll (R2R) printed electronics; surface roughness of the R2R printed pattern; tension; thickness of the R2R printed pattern;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2010.2067194