DocumentCode
1316613
Title
Microcircuit Accelerated Testing Using High Temperature Operating Tests
Author
Stitch, Morton ; Johnson, Gordon M. ; Kirk, Bruce P. ; Brauer, Joseph B.
Author_Institution
McDonnell Douglas Astronautics-East//Dept. E261, P.O. Box 516//St. Louis, Mo. 63166 USA
Issue
4
fYear
1975
Firstpage
238
Lastpage
250
Abstract
The general validity and effectiveness of accelerated tests of microcircuits using both temperature and voltage as accelerating stresses has been demonstrated. However, the inherent effectiveness of the accelerated tests can only be assured through careful selection of the life-test circuit-configuration, and test temperatures, and the effective analysis of the resulting failure data. Careful selection of the accelerating electrical and thermal stresses is essential for maximum acceleration of use-condition failure-mechanisms without introducing damaging or unrealistic failure modes. Effective mathematical analysis of the test data is necessary to ensure an accurate determination of use-condition failure-rates. A discussion of the techniques utilized to conduct microcircuit accelerated life testing and a detailed description of a recent microcircuit accelerated test study program conducted under contract to the Rome Air Development Center are presented.
Keywords
Acceleration; Circuit testing; Contracts; Failure analysis; Life estimation; Life testing; Mathematical analysis; Temperature; Thermal stresses; Voltage;
fLanguage
English
Journal_Title
Reliability, IEEE Transactions on
Publisher
ieee
ISSN
0018-9529
Type
jour
DOI
10.1109/TR.1975.5215180
Filename
5215180
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