• DocumentCode
    1316613
  • Title

    Microcircuit Accelerated Testing Using High Temperature Operating Tests

  • Author

    Stitch, Morton ; Johnson, Gordon M. ; Kirk, Bruce P. ; Brauer, Joseph B.

  • Author_Institution
    McDonnell Douglas Astronautics-East//Dept. E261, P.O. Box 516//St. Louis, Mo. 63166 USA
  • Issue
    4
  • fYear
    1975
  • Firstpage
    238
  • Lastpage
    250
  • Abstract
    The general validity and effectiveness of accelerated tests of microcircuits using both temperature and voltage as accelerating stresses has been demonstrated. However, the inherent effectiveness of the accelerated tests can only be assured through careful selection of the life-test circuit-configuration, and test temperatures, and the effective analysis of the resulting failure data. Careful selection of the accelerating electrical and thermal stresses is essential for maximum acceleration of use-condition failure-mechanisms without introducing damaging or unrealistic failure modes. Effective mathematical analysis of the test data is necessary to ensure an accurate determination of use-condition failure-rates. A discussion of the techniques utilized to conduct microcircuit accelerated life testing and a detailed description of a recent microcircuit accelerated test study program conducted under contract to the Rome Air Development Center are presented.
  • Keywords
    Acceleration; Circuit testing; Contracts; Failure analysis; Life estimation; Life testing; Mathematical analysis; Temperature; Thermal stresses; Voltage;
  • fLanguage
    English
  • Journal_Title
    Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9529
  • Type

    jour

  • DOI
    10.1109/TR.1975.5215180
  • Filename
    5215180