• DocumentCode
    1317239
  • Title

    Speed limitations of multilayer digital packages

  • Author

    Conn, D.R. ; Xie, Shengli

  • Author_Institution
    Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
  • Volume
    26
  • Issue
    21
  • fYear
    1990
  • Firstpage
    1751
  • Lastpage
    1753
  • Abstract
    The limitations that are imposed on the performance of high-speed digital devices by multilayer ceramic packages are presented. It is demonstrated that the maximum speed of the system is limited by the package ground plane and that a maximum data rate of 11 Gbit/s can be achieved with multilayer packages using 0.75 mu m MESFET devices.
  • Keywords
    ceramics; field effect integrated circuits; integrated circuit technology; packaging; printed circuits; 0.75 micron; 11 Gbit/s; MESFET devices; PCB ground plane; high-speed digital devices; maximum data rate; maximum speed; multilayer ceramic packages; multilayer digital packages; package ground plane; speed limitations;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19901125
  • Filename
    83092
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1317239