DocumentCode :
1320067
Title :
Foreword contributions from the ITherm´98 to thermal management
Author :
Lee, T.-Y.T. ; Ramakrishna, K. ; Amon, C.H.
Author_Institution :
Motorola, Inc.
Volume :
23
Issue :
1
fYear :
2000
fDate :
3/1/2000 12:00:00 AM
Firstpage :
3
Lastpage :
5
Keywords :
Electronic packaging thermal management; Electronics cooling; Heat sinks; Heat transfer; Multichip modules; Temperature sensors; Thermal management; Thermal management of electronics; Thermomechanical processes; Trigeneration;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2000.833035
Filename :
833035
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1320067
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