Title :
Full software analysis and impedance matching of radio frequency CMOS integrated circuits
Author :
Kim, Ki Hyuk ; Chung, Hoi Ju ; Yoon, Sung Ho ; Hwang, Sung Woo ; Park, Jinwoo ; Kim, Soo-Won ; Choi, Joongho ; Ahn, Doyeol
Author_Institution :
Dept. of Electron. Eng., Korea Univ., Seoul, South Korea
fDate :
3/1/2000 12:00:00 AM
Abstract :
We present a systematic analysis technique of complementary metal-oxide-semiconductor (CMOS) radio-frequency (RF) integrated circuits (ICs). A full simulation program with integrated circuit emphasis (SPICE) simulation of the whole chip including the package and the die, with the parameters extracted from purely software analysis, has been performed. It is shown that the RF impedance matching without S-parameter based techniques is possible and the measured results agree well with our SPICE-only software based technique
Keywords :
CMOS integrated circuits; SPICE; UHF integrated circuits; circuit simulation; field effect MMIC; impedance matching; integrated circuit interconnections; integrated circuit packaging; SPICE simulation; die; impedance matching; package; radio frequency CMOS integrated circuits; software analysis; Analytical models; CMOS integrated circuits; Circuit simulation; Impedance matching; Integrated circuit packaging; Radio frequency; Radiofrequency integrated circuits; SPICE; Software packages; Software performance;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/6144.833059
