DocumentCode :
1323024
Title :
Corrosion Resistance of Several Integrated-Circuit Metallization Systems
Author :
Cunningham, James A. ; Fuller, Clyde R. ; Haywood, C.T.
Author_Institution :
Texas Instruments Incorporated, 12201 Southwest Freeway, Stafford, Tex.
Issue :
4
fYear :
1970
Firstpage :
182
Lastpage :
187
Abstract :
Accelerated life data are presented on several integratedcircuit metallization systems including Al, Mo-Au, Ti-Pt-Au, and a new system Ti: W-Au where the RF sputtered Ti: W layer is a pseudo alloy of 10-20 percent Ti in W. Life tests include total water immersion, high-pressure steam and 85°C/85 percent RH/bias on bare and plastic-encapsulated devices. Heat-age and resistivity-ratio data are presented showing the metallurgical stability of the Ti: W-Au system. The corrosion resistance decreases as Ti-Pt-Au > Ti: W-Au >> Mo-Au ¿ Al.
Keywords :
Assembly; Circuit testing; Corrosion; Costs; Integrated circuit reliability; Metallization; Passivation; Plastics; Semiconductor device packaging; System testing;
fLanguage :
English
Journal_Title :
Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9529
Type :
jour
DOI :
10.1109/TR.1970.5216441
Filename :
5216441
Link To Document :
بازگشت