• DocumentCode
    1326318
  • Title

    Finite-Element Analysis of Dump Resistor for Prototype Superconducting Magnet Carrying 3.60 MA-t

  • Author

    Kedia, Sunil ; Roy, Swati ; Pradhan, Subrata

  • Author_Institution
    Inst. for Plasma Res., Gandhinagar, India
  • Volume
    20
  • Issue
    6
  • fYear
    2010
  • Firstpage
    2354
  • Lastpage
    2359
  • Abstract
    Stability margin, transient ac responses, and protection of the magnet system in the case of abnormal quench are some of the important design drivers of superconducting magnets for fusion reactors. A prototype magnet has been designed using a cable-in-conduit conductor with a nominal operation current of 30 kA at 12 T and 5 K at the Institute for Plasma Research, Gandhinagar, India. Protection of the magnet system during off-normal scenarios leading to quench makes the operation of the magnet system more challenging. An external dump resistor is required to extract the stored magnetic energy of the magnet in case of quench. Such a dump resistor has been designed for this 3.60 MA-turns current-carrying prototype superconducting magnet. Finite-element thermal, structural, and electromagnetic analyses have been done for validating the dump resistor parameters using commercially available Ansys software. The maximum temperature rise of the dump resistor system is found to be 540 K, considering cool down by natural convection only. In addition, the maximum stress between the parallel plates of the is found to be less than 1.0 GPa, which is in the acceptable range.
  • Keywords
    finite element analysis; niobium alloys; resistors; superconducting magnets; tin alloys; type II superconductors; Ansys software; Nb3Sn; cable-in-conduit conductor; current 30 kA; dump resistor; electromagnetic analyses; finite-element analysis; magnetic flux density 12 T; superconducting magnet; temperature 5 K; Finite element methods; Magnetic separation; Magnetomechanical effects; Resistors; Superconducting magnets; Thermal stresses; cable-in-conduit conductor (CICC); dump resistor; electromagnetic stress; finite-element (FE) analysis; thermal stress;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2010.2070502
  • Filename
    5575394