DocumentCode
132870
Title
Investigating the influence of semiconductor device voltage drops on harmonic and reactive current compensation with cascaded multilevel inverters
Author
Deliang Wu ; Shuo Wang ; Li Peng
Author_Institution
State Key Lab. of Adv., Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear
2014
fDate
16-20 March 2014
Firstpage
2156
Lastpage
2162
Abstract
Cascaded multilevel inverter is a superior option for static var compensators and active power filters, especially in high voltage and/or high power applications due to its modular structure and distributed voltage stress and switching losses among switching devices. The influence of semiconductor device on-state voltage drops on the harmonic current and reactive power compensation in a cascaded multilevel inverter is studied in this paper. It has been found that device voltage drops may cause severe distortions to the output voltage of the cascaded multilevel inverter. It greatly deteriorates the compensation performance. In this paper, analysis, simulation and experiments were conducted to study the influence of the device voltage drops on a cascaded multilevel inverter based harmonic current and reactive power compensator. Based on the analysis of the steady-state waveforms in frequency domain, a technique to reduce the influence of device voltage drops is proposed and verified by simulation results.
Keywords
active filters; electric potential; frequency-domain analysis; invertors; power filters; reactive power; semiconductor devices; static VAr compensators; active power filters; cascaded multilevel inverters; distributed voltage stress; frequency domain; high power applications; high voltage applications; modular structure; reactive current compensation; semiconductor device on-state voltage drops; static Var compensators; steady-state waveforms; switching devices; switching losses; Harmonic analysis; Insulated gate bipolar transistors; Inverters; Power system harmonics; Semiconductor diodes; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition (APEC), 2014 Twenty-Ninth Annual IEEE
Conference_Location
Fort Worth, TX
Type
conf
DOI
10.1109/APEC.2014.6803604
Filename
6803604
Link To Document