• DocumentCode
    1333945
  • Title

    Efficient transient simulation of high-speed interconnects characterized by sampled data

  • Author

    Beyene, Wendemagegnehu T. ; Schutt-Ainé, Jose E.

  • Author_Institution
    Hewlett-Packard Co., Westlake Village, CA, USA
  • Volume
    21
  • Issue
    1
  • fYear
    1998
  • fDate
    2/1/1998 12:00:00 AM
  • Firstpage
    105
  • Lastpage
    114
  • Abstract
    In this paper, we present an algorithm for efficient simulation of high-speed interconnects characterized by sampled data. The method constructs pole-zero models of arbitrary interconnects using robust rational approximations of the measured or simulated scattering parameters. In order to obtain accurate interpolations of the data over a wide frequency range, a set of powerful techniques is applied to deal with the resulting ill-conditioned Vandermonde-like approximation matrices. By utilizing the analytic properties of the scattering parameters, the algorithm efficiently generates multiport pole-residue models. The models are combined with the lumped/distributed components for direct time- or frequency-domain simulations. The method can easily be implemented into conventional simulators such as simulation program with integrated circuit emphasis (SPICE) and advanced statistical analysis program (ASTAP) or reduced-order modeling techniques such as asymptotic waveform evaluation (AWE), complex frequency hopping (CFH), and Padd approximation via Lancros Process (PVL) for transient simulation of high-speed interconnect networks. Examples of linear and nonlinear networks are given to demonstrate the validity and accuracy of the method
  • Keywords
    S-parameters; circuit analysis computing; integrated circuit interconnections; interpolation; multiport networks; poles and zeros; reduced order systems; transient analysis; ASTAP; AWE; CFH; PVL; SPICE; Vandermonde matrix; algorithm; distributed component; frequency-domain simulation; high-speed interconnect; interpolation; linear network; lumped component; multiport pole-residue model; nonlinear network; pole-zero model; rational approximation; reduced-order model; sampled data; scattering parameters; time-domain simulation; transient simulation; Algorithm design and analysis; Analytical models; Circuit simulation; Frequency domain analysis; Integrated circuit interconnections; Interpolation; Robustness; SPICE; Scattering parameters; Statistical analysis;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.659513
  • Filename
    659513