Title :
Use of hydroxyl-modified carbon nanotubes for detecting SF6 decomposition products under partial discharge in gas insulated switchgear
Author :
Xiaoxing Zhang ; Fansheng Meng ; Bing Yang
Author_Institution :
State Key Lab. of Power Transm. Equip. & Syst. Security & New Technol., Chongqing Univ., Chongqing, China
Abstract :
Gas-insulated switchgear (GIS) has inherent internal defects that may result in partial discharge (PD) and the eventual development of equipment faults. PD in GIS can lead to the generation of multiple decomposition products of SF6, and the detection and analysis of these decomposition products is important for fault diagnosis. In this paper, a molecular dynamics simulation software package, Materials Studio (MS), is used to model accurately the processes by which single-walled carbon nanotubes modified by hydroxyl (SWNT-OH) adsorb the main decomposition products of SF6 (SOF2, SO2F2, SO2 and CF4) generated by PD. In addition, experimental studies are performed to validate the predicted gas-sensing characteristics. The theoretical calculations and experimental results both indicate that, of the four gases, SWNT-OH showed the fastest response time and highest sensitivity to SO2. The sensitivities of SWNT-OH to the other gases were low, and response times long. We conclude that SWNT-OH shows good sensitivity and selectivity to SO2.
Keywords :
SF6 insulation; carbon nanotubes; fault diagnosis; gas insulated switchgear; molecular dynamics method; partial discharges; GIS; Materials Studio software; SF6; SF6 decomposition product; SO2; SO2F2; SOF2; equipment fault diagnosis; gas insulated switchgear; gas-sensing characteristic; hydroxyl-modified carbon nanotube; molecular dynamics simulation software package; partial discharge; single-walled carbon nanotube; Adsorption; Charge transfer; Materials; Partial discharges; Sensitivity; Sulfur hexafluoride; Carbon nanotubes; SF6; decomposition product; gas sensor; partial discharge; simulation;
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
DOI :
10.1109/TDEI.2013.6678876