DocumentCode
1334835
Title
High Efficiency N-Type Emitter-Wrap-Through Silicon Solar Cells
Author
Kiefer, Fabian ; Ulzhöfer, Christian ; Brendemühl, Till ; Harder, Nils-Peter ; Brendel, Rolf ; Mertens, Verena ; Bordihn, Stefan ; Peters, Christina ; Müller, Jörg W.
Author_Institution
Inst. for Solar Energy Res. Hamelin, Emmerthal, Germany
Volume
1
Issue
1
fYear
2011
fDate
7/1/2011 12:00:00 AM
Firstpage
49
Lastpage
53
Abstract
In the ALBA-II project, Q-Cells SE, Bitterfeld-Wolfen, Germany, and the Institute for Solar Energy Research Hamelin, Emmerthal, Germany, are developing high-efficiency emitter-wrap-through (EWT) solar cells on n-type silicon wafers. N-type silicon grown by the Czochralski (Cz) method forms the basis of this high-efficiency solar cell development as it offers high bulk carrier lifetimes. The EWT device structure allows us to employ a simplified process sequence compared with interdigitated back-contact back-junction solar cells. High open-circuit voltages of our solar cells are achieved by different passivation layers for base and emitter surfaces and picosecond laser ablated contact openings. An optimization of the resistances along the current paths in base and emitter leads to an improvement in fill factor (FF) over former EWT solar cells. Together with the inherently high current densities of EWT solar cells, we achieve on our small-area (4-cm2, designated area without busbars) cells a short-circuit current density JSC of 40.4 mA/cm2, an open-circuit voltage VOC of 661 mV, FFs well above 80%, and, thus, cell efficiencies of up to 21.6%.
Keywords
carrier lifetime; crystal growth from melt; current density; electric resistance; elemental semiconductors; laser ablation; optimisation; passivation; semiconductor growth; silicon; solar cells; Czochralski method; EWT device structure; EWT solar cells; Si; bulk carrier lifetimes; cell efficiencies; current paths; emitter surface; fill factor; high efficiency n-type emitter-wrap-through silicon solar cells; high-efficiency solar cell development; n-type silicon wafers; open-circuit voltages; passivation layers; picosecond laser ablated contact openings; process sequence; resistance optimization; short-circuit current density; small-area cells; Passivation; Photovoltaic cells; Photovoltaic systems; Silicon; Solar energy; Surface emitting lasers; Emitter-wrap-through (EWT); n-type silicon; silicon solar cells;
fLanguage
English
Journal_Title
Photovoltaics, IEEE Journal of
Publisher
ieee
ISSN
2156-3381
Type
jour
DOI
10.1109/JPHOTOV.2011.2164953
Filename
6029955
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