DocumentCode :
1337904
Title :
Measurements of the novel thermal conduction of a porphoritic heat sink paste
Author :
Artus, Raymonde G C
Author_Institution :
J.J. Thomson Phys. Lab., Reading Univ., UK
Volume :
19
Issue :
3
fYear :
1996
fDate :
8/1/1996 12:00:00 AM
Firstpage :
601
Lastpage :
604
Abstract :
The thermal conduction of a solid/liquid porphoritic heat sink material having a specific geometry is reported. This new material consists of submicron-size diamond particles dispersed in n-decane at high packing fractions. Although each constituent has a measured decrease in thermal conduction with increasing temperature, the thermal conduction of the mixture shows a unique and significant increase with increasing temperature. This novel increase in thermal conduction has particular relevance to the thermal management of die that have uneven heat dissipation requirements. The material also has particular application in the construction and thermal design of multichip modules (MCM´s)
Keywords :
cooling; heat conduction; heat sinks; multichip modules; multichip modules; n-decane; packing fractions; porphoritic heat sink paste; solid/liquid porphoritic heat sink material; submicron-size diamond particles; thermal conduction; thermal management; uneven heat dissipation requirements; Building materials; Conducting materials; Geometry; Heat sinks; Modular construction; Multichip modules; Solids; Temperature; Thermal conductivity; Thermal management;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9894
Type :
jour
DOI :
10.1109/96.533902
Filename :
533902
Link To Document :
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