DocumentCode
1343521
Title
Transient Simulation of Complex High-Speed Channels via Waveform Relaxation
Author
Loggia, Vittorio ; Grivet-Talocia, Stefano ; Hu, Haisheng
Author_Institution
Dept. of Electron., Politec. di Torino, Turin, Italy
Volume
1
Issue
11
fYear
2011
Firstpage
1823
Lastpage
1838
Abstract
This paper presents a class of numerical schemes for fast transient simulation of electrically long and complex linear channels terminated by linear or nonlinear networks. The common denominator of all schemes is waveform relaxation. Domain decomposition approaches based on longitudinal and transverse partitioning are pursued, leading to various iterative methods characterized by different properties and numerical efficiency. For each scheme, we present a detailed convergence analysis and a set of numerical results obtained on industrial benchmarks. The main contribution of this paper is a novel theoretical framework based on a combination of longitudinal and transverse relaxation, leading to particularly efficient simulations when combined with compact channel representations based on delay-rational macromodels. Our prototypal implementation outperforms SPICE solvers, with speedup of up to two orders of magnitude.
Keywords
convergence of numerical methods; iterative methods; nonlinear network analysis; transient analysis; SPICE solver; compact channel representation; complex high-speed channel; convergence analysis; delay-rational macromodel; domain decomposition; efficient simulation; fast transient simulation; longitudinal partitioning; nonlinear network; numerical efficiency; numerical scheme; transverse partitioning; transverse relaxation; waveform relaxation; Benchmark testing; Convolution; Delay lines; Receivers; Scattering; Time domain analysis; Transient analysis; Delay extraction; high-speed interconnects; longitudinal partitioning; macromodeling; rational approximations; scattering parameters; transmission lines; transverse partitioning; waveform relaxation;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2011.2167146
Filename
6036159
Link To Document