Title :
Sensitivity analysis of multiconductor transmission lines and optimization for high-speed interconnect circuit design
Author :
Jiao, Cheng ; Cangellaris, Andreas C. ; Yaghmour, Abdul M. ; Prince, John L.
Author_Institution :
Centre for Electron. Packaging Res., Arizona Univ., Tucson, AZ, USA
fDate :
5/1/2000 12:00:00 AM
Abstract :
Sensitivity analysis of multiconductor transmission lines is derived from a new, all-purpose multi-conductor transmission line model in both frequency domain and time domain. Computer implementation of this new model as well as the sensitivity analysis has been completed. It enables efficient, accurate simulations of interconnect circuit responses as well as sensitivity analysis with respect to both electrical and physical transmission line parameters. By applying sensitivity analysis to high-speed interconnect circuit design, design variables are optimized to achieve simultaneous minimization of crosstalk, delays and reflections at desired nodes in the circuit without violating any indispensable design rules. Numerical examples are presented to demonstrate the validity of the proposed sensitivity analysis and illustrate its application to the optimization of high-speed interconnect circuit design
Keywords :
VLSI; circuit optimisation; crosstalk; delays; frequency-domain analysis; high-speed integrated circuits; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; multiconductor transmission lines; sensitivity analysis; time-domain analysis; crosstalk; delays; design rules; frequency domain; high-speed interconnect circuit design; interconnect circuit responses; multiconductor transmission lines; optimization; reflections; sensitivity analysis; time domain; transmission line parameters; Analytical models; Circuit synthesis; Computational modeling; Design optimization; Distributed parameter circuits; Frequency domain analysis; Integrated circuit interconnections; Multiconductor transmission lines; Sensitivity analysis; Time domain analysis;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.846623