DocumentCode :
1347060
Title :
SOI for digital CMOS VLSI: design considerations and advances
Author :
Chuang, Ching-Te ; Lu, Pong-Fei ; Anderson, Carl J.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Volume :
86
Issue :
4
fYear :
1998
fDate :
4/1/1998 12:00:00 AM
Firstpage :
689
Lastpage :
720
Abstract :
This paper reviews the recent advances of silicon-on-insulator (SOI) technology for complementary metal-oxide-semiconductor (CMOS) very-large-scale-integration memory and logic applications. Static random access memories (SRAMs), dynamic random access memories (DRAMs), and digital CMOS logic circuits are considered. Particular emphases are placed on the design issues and advantages resulting from the unique SOI device structure. The impact of floating-body in partially depleted devices on the circuit operation, stability, and functionality are addressed. The use of smart-body contact to improve the power and delay performance is discussed, as are global design issues
Keywords :
CMOS digital integrated circuits; VLSI; circuit stability; delays; integrated circuit design; silicon-on-insulator; DRAM; SOI; SRAM; VLSI; circuit stability; delay performance; design considerations; digital CMOS; floating-body; functionality; global design issues; logic circuits; partially depleted devices; power performance; smart-body contact; CMOS logic circuits; CMOS technology; DRAM chips; Delay; Integrated circuit technology; Isolation technology; Large-scale systems; SRAM chips; Silicon on insulator technology; Very large scale integration;
fLanguage :
English
Journal_Title :
Proceedings of the IEEE
Publisher :
ieee
ISSN :
0018-9219
Type :
jour
DOI :
10.1109/5.663545
Filename :
663545
Link To Document :
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