DocumentCode
1347366
Title
High speed Si-OEIC (OPIC) for optical pickup
Author
Takimoto, Takahiro ; Fukunaga, Naoki ; Kubo, Masaru ; Okabayashi, Naonori
Author_Institution
Opto-Electron. Device Div., Sharp Corp., Japan
Volume
44
Issue
1
fYear
1998
fDate
2/1/1998 12:00:00 AM
Firstpage
137
Lastpage
142
Abstract
An optical pickup OPICTM with a built-in high-speed split photodiode and new device structure, has been developed. We have successfully fabricated the OPIC with a cutoff frequency of 56 MHz for 780 nm wavelength radiation. We developed hologram laser in which a semiconductor laser, the OPIC and hologram glass are set as a unit, too. The development of these OPIC were made possible by the high-speed split photodiode, which have very high resistive Si substrate for reduction of the junction capacitance. The cutoff frequency of the high speed split photodiode thus realized is 61 MHz for 780 nm wavelength radiation. This photodiode has a double-layer anti-reflection film consisting of a silicon oxide film as the first layer and a silicon nitride film as the second layer. We show the structure of this new device, its fabrication process and the performance of the photodiode and OPIC
Keywords
CD-ROMs; integrated circuit technology; integrated optoelectronics; photodiodes; pick-ups; semiconductor lasers; silicon; 56 MHz; 61 MHz; 780 nm; CD ROM drives; OPIC; Si; SiN3; SiO2; cutoff frequency; device structure; double-layer anti-reflection film; fabrication process; high-speed split photodiode; hologram glass; hologram laser; junction capacitance reduction; optical pickup; performance; semiconductor laser; wavelength radiation; Cutoff frequency; Glass; High speed optical techniques; Laser beam cutting; Optical devices; Optical films; Photodiodes; Semiconductor films; Semiconductor lasers; Silicon;
fLanguage
English
Journal_Title
Consumer Electronics, IEEE Transactions on
Publisher
ieee
ISSN
0098-3063
Type
jour
DOI
10.1109/30.663740
Filename
663740
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