DocumentCode
1355201
Title
Design and fabrication of a low-cost microengineered silicon pressure sensor with linearised output
Author
Beeby, S.P. ; Stuttle, M. ; White, N.M.
Author_Institution
Dept. of Electron. & Comput. Sci., Southampton Univ., UK
Volume
147
Issue
3
fYear
2000
fDate
5/1/2000 12:00:00 AM
Firstpage
127
Lastpage
130
Abstract
The design and fabrication of a capacitive pressure sensor comprising two microengineered silicon wafers fusion-bonded together to provide a relatively low-cost pressure sensor is described. The sensor produces a capacitance change of around 100 pF for an applied pressure of eight bar. The capacitance change is measured using a charge redistribution technique. The sensor has been designed to enable subsequent linearisation within a microcontroller. The same microcontroller is also used to calibrate the device, implement a successive approximation register within the charge redistribution circuit, and drive an LCD resulting in an elegant and potentially low-cost system
Keywords
calibration; capacitive sensors; elemental semiconductors; linearisation techniques; liquid crystal displays; microcontrollers; micromachining; microsensors; pressure sensors; readout electronics; silicon; wafer bonding; 100 pF; 8 bar; LCD; Si; capacitive pressure sensor; charge redistribution circuit; charge redistribution technique; design; fabrication; fusion-bonding; linearisation; linearised output; low-cost microengineered silicon pressure sensor; low-cost pressure sensor; low-cost system; microcontroller; microengineered silicon wafers; successive approximation register;
fLanguage
English
Journal_Title
Science, Measurement and Technology, IEE Proceedings -
Publisher
iet
ISSN
1350-2344
Type
jour
DOI
10.1049/ip-smt:20000355
Filename
850596
Link To Document