• DocumentCode
    1355201
  • Title

    Design and fabrication of a low-cost microengineered silicon pressure sensor with linearised output

  • Author

    Beeby, S.P. ; Stuttle, M. ; White, N.M.

  • Author_Institution
    Dept. of Electron. & Comput. Sci., Southampton Univ., UK
  • Volume
    147
  • Issue
    3
  • fYear
    2000
  • fDate
    5/1/2000 12:00:00 AM
  • Firstpage
    127
  • Lastpage
    130
  • Abstract
    The design and fabrication of a capacitive pressure sensor comprising two microengineered silicon wafers fusion-bonded together to provide a relatively low-cost pressure sensor is described. The sensor produces a capacitance change of around 100 pF for an applied pressure of eight bar. The capacitance change is measured using a charge redistribution technique. The sensor has been designed to enable subsequent linearisation within a microcontroller. The same microcontroller is also used to calibrate the device, implement a successive approximation register within the charge redistribution circuit, and drive an LCD resulting in an elegant and potentially low-cost system
  • Keywords
    calibration; capacitive sensors; elemental semiconductors; linearisation techniques; liquid crystal displays; microcontrollers; micromachining; microsensors; pressure sensors; readout electronics; silicon; wafer bonding; 100 pF; 8 bar; LCD; Si; capacitive pressure sensor; charge redistribution circuit; charge redistribution technique; design; fabrication; fusion-bonding; linearisation; linearised output; low-cost microengineered silicon pressure sensor; low-cost pressure sensor; low-cost system; microcontroller; microengineered silicon wafers; successive approximation register;
  • fLanguage
    English
  • Journal_Title
    Science, Measurement and Technology, IEE Proceedings -
  • Publisher
    iet
  • ISSN
    1350-2344
  • Type

    jour

  • DOI
    10.1049/ip-smt:20000355
  • Filename
    850596