• DocumentCode
    136113
  • Title

    Out-diffusion of cesium and rubidium from amorphized silicon during solid-phase epitaxial regrowth

  • Author

    Maier, Robert ; Haublein, V. ; Ryssel, H.

  • Author_Institution
    Lehrstuhl fur Fraunhofer Elektron. Bauelemente, Friedrich-Alexander-Univ. Erlangen-Nurnberg, Erlangen, Germany
  • fYear
    2014
  • fDate
    June 26 2014-July 4 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Rutherford Backscattering Spectroscopy was used to analyze and quantify the out-diffusion of Cs and Rb from silicon during solid-phase epitaxial regrowth under N2 atmosphere. Out-diffused amounts of about 60% Rb and 30% Cs were determined. The transient out-diffusion behavior of the alkali atoms in ultra-high vacuum was monitored during recrystallization by secondary neutral mass spectroscopy. The analysis showed that the alkali atoms diffuse out without forming chemical bonds which are critical for the proposed application. With our results it could be estimated that this filling method has a potential to replace other methods for producing atomic vapor cells.
  • Keywords
    Rutherford backscattering; amorphous semiconductors; caesium; diffusion; elemental semiconductors; mass spectroscopy; recrystallisation; rubidium; semiconductor epitaxial layers; semiconductor growth; silicon; solid phase epitaxial growth; Rutherford backscattering spectroscopy; Si:Cs,Rb; alkali atoms; amorphized silicon; atomic vapor cells; cesium; diffusion; recrystallization; rubidium; secondary neutral mass spectroscopy; solid-phase epitaxial regrowth; transient out-diffusion behavior; ultrahigh vacuum; Annealing; Atmosphere; Atomic clocks; Atomic measurements; Filling; Monitoring; Silicon; SPER; alkali elements; atomic clock; cesium; out-diffusion; rubidium; solid-phase epitaxial regrowth; vapor cell;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ion Implantation Technology (IIT), 2014 20th International Conference on
  • Conference_Location
    Portland, OR
  • Type

    conf

  • DOI
    10.1109/IIT.2014.6939974
  • Filename
    6939974