• DocumentCode
    136158
  • Title

    SuperScan™: Customized wafer dose patterning

  • Author

    Todorov, Stan S. ; Sawyer, John ; Gibilaro, Greg ; Hussey, Norm ; Gammel, George ; Olden, David ; Welsch, Marie ; Parisi, Nick

  • Author_Institution
    Varian Semicond. Equip., Appl. Mater., Gloucester, MA, USA
  • fYear
    2014
  • fDate
    June 26 2014-July 4 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Deliberately non-uniform dose implants are used in the industry to improve device performance across the wafer by compensating for non-uniformities introduced by process steps other than implantation. Varian ion implanters have offered this SuperScan™ capability for close to ten years [1-3]. Recent developments in SuperScan on Varian mid-current implanters significantly expand the ability to deliver virtually any desired dose pattern to wafer. This is accomplished by the introduction of new algorithms allowing custom dose delivery for any scan line and is enabled by the development of an enhanced dose controller and two-dimensional beam profiler. SuperScan 3 is capable of producing centered and off-center patterns without the need for wafer rotation with a zone dose ratio as high as 7:1 while maintaining excellent dose accuracy and uniformity within the different zones.
  • Keywords
    ion implantation; semiconductor device manufacture; semiconductor doping; SuperScan; centered patterns; customized wafer dose patterning; device performance; enhanced dose controller; nonuniform dose implants; off-center patterns; scan line; semiconductor device doping; two-dimensional beam profiler; varian ion implanters; varian mid-current implanters; wafer rotation; zone dose ratio; Accuracy; Graphical user interfaces; Implants; Ion implantation; Performance evaluation; Shape; Three-dimensional displays; ion implantation; semiconductor device doping; semiconductor manufacturing process control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ion Implantation Technology (IIT), 2014 20th International Conference on
  • Conference_Location
    Portland, OR
  • Type

    conf

  • DOI
    10.1109/IIT.2014.6940019
  • Filename
    6940019