The effects of scaling on Back End of Line Processing

Author

Verdonck, Patrick ; Wilson, Christopher J. ; Liang Gong Wen

Author_Institution

imec, Leuven, Belgium

fYear

2014

fDate

1-5 Sept. 2014

Firstpage

1

Lastpage

4

Abstract

Back End of Line Processing has an ever increasing impact on the whole of integrated circuit manufacturing. Its influence on the delay of the signals is already for some nodes higher than the Front End of Line Processes. Besides, for the more advanced nodes, the back end cost will be as high or higher than the front end cost. The technological challenges are ever more difficult to meet, the red brick wall looms for different unit processes. In this paper, we´ll review some of the most interesting issues that scaling is causing to Back End Of Line processing.

Keywords

integrated circuit interconnections; integrated circuit manufacture; integrated circuit metallisation; low-k dielectric thin films; photolithography; advanced nodes; back end cost; back end of line processing; front end cost; front end of line processes; integrated circuit manufacturing; interconnect metal level; lithography; low-k films; metallization; red brick wall; signal delay; Air gaps; Dielectrics; Etching; Films; Metallization; Reliability; BEOL; damascene; dielectric films; etching; lithography; metallization;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics Technology and Devices (SBMicro), 2014 29th Symposium on

Conference_Location

Aracaju

Type

conf

DOI

10.1109/SBMicro.2014.6940080

Filename

6940080