A full-wave characterization of an interconnecting line printed on a dielectric slab backed by a gridded ground plane

Author

Bernardi, Paolo ; Cicchetti, Renato ; Faraone, Antonio

Author_Institution

Dept. of Electron. Eng., Rome Univ., Italy

Volume

38

Issue

3

fYear

1996

fDate

8/1/1996 12:00:00 AM

Firstpage

237

Lastpage

243

Abstract

The electromagnetic behavior of a planar structure formed by a conducting strip printed on a dielectric slab backed by a gridded ground plane is analyzed in order to outline the characteristics of this type of interconnect often used in microwave integrated circuits and digital applications. A two-port equivalent model, based on the Z-matrix network representation, is adopted to study the electrical properties of the structure. The Z-parameters have been determined by means of a full-wave spectral domain methodology. Numerical results concerning the properties of this type of interconnect for different grid geometries are presented, and the effects related to the radiation from the strip and the gridded ground plane are pointed out

Keywords

digital integrated circuits; earthing; electromagnetic compatibility; integrated circuit interconnections; microstrip lines; microwave integrated circuits; printed circuit layout; spectral-domain analysis; two-port networks; waveguide theory; PCB; Z-matrix network representation; Z-parameters; conducting strip; dielectric slab; digital applications; electrical properties; electromagnetic behavior; full-wave characterization; grid geometries; gridded ground plane; interconnecting line; microwave integrated circuits; planar structure; radiation; spectral domain methodology; two-port equivalent model; Crosstalk; Dielectrics; Electrodynamics; Grounding; Integral equations; Integrated circuit interconnections; LAN interconnection; Slabs; Strips; Voltage;

fLanguage

English

Journal_Title

Electromagnetic Compatibility, IEEE Transactions on

Publisher

ieee

ISSN

0018-9375

Type

jour

DOI

10.1109/15.536052

Filename

536052