Title :
Ultracompact UHF Tunable Filter Embedded Into Multilayered Organic Packaging Substrate
Author :
Lee, Tae-Chang ; Cheon, Seong-Jong ; Park, Jae-Yeong
Author_Institution :
Dept. of Electron. Eng., Kwangwoon Univ., Seoul, South Korea
Abstract :
In this paper, we developed a new ultracompact ultrahigh frequency tunable band-pass filter embedded into multilayered organic packaging substrate with high dielectric composite film. For embedding the tunable filter circuit into the packaging substrate, it was modified by using a scalable lumped circuit model instead of using magnetically coupled resonant circuit. Since most of the conventional TV receiver tuners utilize magnetically coupled circuit, which is formed of several passive components and air core inductors assembled and controlled manually, there are several problems such as large size, difficulty in tuning, and high cost. The embedded tunable filter was optimally designed to obtain high performances by using high Q spiral stacked inductors, high dielectric SrTiO3 composite metal-insulator-metal capacitors, and surface mounted varactor diodes. It exhibited low insertion loss of approximately -2 dB, return less than -10 dB, large tuning range of 56.3% and tunable frequency ranged from 500 to 900 MHz. It had extremely compact size and volume of 3.4 × 4.4 × 0.6 mm3, which was the smallest one in the reported tunable filters for TV tuner receivers.
Keywords :
UHF filters; air; band-pass filters; capacitors; diodes; electronics packaging; inductors; receivers; varactors; TV receiver tuner; air core inductor; dielectric composite film; frequency 500 MHz to 900 MHz; high Q spiral stacked inductor; high dielectric composite metal-insulator-metal capacitor; magnetically coupled circuit; multilayered organic packaging substrate; passive component; scalable lumped circuit model; surface mounted varactor diode; tunable filter circuit; ultracompact UHF tunable filter; ultracompact ultrahigh frequency tunable band-pass filter; Frequency measurement; Inductors; Loss measurement; Magnetic resonance; Packaging; Substrates; ${rm SrTiO}_{3}$ composite film; embedded passive elements; magnetic coupling; multilayered organic substrate; ultrahigh frequency tunable filter; varactor diodes;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2011.2167620