An optical modulator prepared by silicon micromachining and thermal bonding

Author

Xiao, Zhaohua ; Engström, Olof

Author_Institution

Dept. of Solid State Electron., Chalmers Univ. of Technol., Goteborg, Sweden

Volume

44

Issue

4

fYear

1997

fDate

4/1/1997 12:00:00 AM

Firstpage

572

Lastpage

576

Abstract

An optical modulator using silicon micromachining and thermal bonding is reported. It consists of a pn junction with an optical cavity formed by wafer bonding between n-type and p-type silicon. The cavity is prepared by a thin n-type silicon membrane covering a step with well-controlled dimensions in p-type silicon. Light transmitted through or reflected by the device can be modulated by a second light source with shorter wavelength

Keywords

annealing; electro-optical modulation; micromachining; optical fabrication; optical resonators; silicon; wafer bonding; Si; Si micromachining; light transmission; n-type Si; n-type Si membrane; optical cavity; optical information processing; optical modulator; opto-electro-mechanical properties; p-type Si; pn junction; reflected light intensity; step; thermal annealing; thermal bonding; wafer bonding; Biomembranes; Liquid crystals; Micromachining; Optical devices; Optical interferometry; Optical modulation; Optical sensors; Optical superlattices; Silicon; Wafer bonding;

fLanguage

English

Journal_Title

Electron Devices, IEEE Transactions on

Publisher

ieee

ISSN

0018-9383

Type

jour

DOI

10.1109/16.563360

Filename

563360