DocumentCode :
1377997
Title :
Mobility Enhancement in Strained n -FinFETs: Basic Insight and Stress Engineering
Author :
Serra, Nicola ; Esseni, David
Author_Institution :
Dept. of Electr., Manage. & Mech. Eng. (DIEGM ), Univ. of Udine, Udine, Italy
Volume :
57
Issue :
2
fYear :
2010
Firstpage :
482
Lastpage :
490
Abstract :
This paper presents both analytical models and Monte Carlo simulations concerning strain engineering in n-type silicon FinFETs. Our analysis identifies the stress configurations and the physical mechanisms able to produce a significant stress-induced mobility enhancement and provides the insight necessary for device optimization. We first derive analytical expressions for the stress-induced changes of the subband minima and of the transport masses, which clearly identify the stress components leading to mobility improvements. Then, we present multisubband Monte Carlo mobility simulations, which confirm the potentials for remarkable stress-induced mobility enhancements in n-FinFETs.
Keywords :
MOSFET; Monte Carlo methods; elemental semiconductors; internal stresses; semiconductor device models; silicon; stress analysis; stress effects; Si; analytical model; device optimization; multisubband Monte Carlo simulations; n-type silicon FinFET; physical mechanism; strain engineering; strained n-FinFET; stress engineering; stress-induced mobility enhancement; subband minima; transport mass; Analytical models; CMOS integrated circuits; Capacitive sensors; Circuit simulation; Distributed control; Electron mobility; FinFETs; Monte Carlo methods; Silicon; Stress; Crystal orientation; FinFET; electron mobility; strain; strain engineering;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2009.2037369
Filename :
5373947
Link To Document :
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