• DocumentCode
    138020
  • Title

    Design, principles, and testing of a latching modular robot connector

  • Author

    Eckenstein, Nick ; Yim, Mark

  • Author_Institution
    Dept. of Mech. Eng. & Appl. Mech., Univ. of Pennsylvania, Philadelphia, PA, USA
  • fYear
    2014
  • fDate
    14-18 Sept. 2014
  • Firstpage
    2846
  • Lastpage
    2851
  • Abstract
    Connection and disconnection occur often in modular robotics. Furthermore, position errors increase in chain-style modular robots as chains get longer. This paper presents a passive (unactuated) compliant two-layer latching mechanism compatible with planar docking mechanisms such as the X-Face, with design considerations and important design parameters empirically identified. Design parameters such as alignment, face curvature and overhang width are shown to have unintuitive effects on the behavior and strength of the connectors. The latch mechanism has a bonding ratio (force of the bond over force required to engage bond) in the range of 20 to 76, depending on the design parameters used. The paper also presents a reconfiguration control sequence that combines the module actuation forces with the connectors´ natural forces to increase the reliability of the connection process and reduce the maximum force required. In addition, several types of reconfiguration are performed, including reconfiguration with a 12 module long chain that demonstrates the connectors´ robustness to error.
  • Keywords
    robots; X-Face; bonding ratio; chain-style modular robots; connection process; face curvature; latch mechanism; latching modular robot connector; modular robotics; module actuation forces; overhang width; planar docking mechanisms; position errors; reconfiguration control sequence; unactuated compliant two-layer latching mechanism; Connectors; Face; Force; Latches; Neck; Prototypes; Shape;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Intelligent Robots and Systems (IROS 2014), 2014 IEEE/RSJ International Conference on
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/IROS.2014.6942953
  • Filename
    6942953