DocumentCode :
1380541
Title :
Thermal Conductivity Enhancement of Benzocyclobutene With Carbon Nanotubes for Adhesive Bonding in 3-D Integration
Author :
Xu, Xiangming ; Wang, Zheyao
Author_Institution :
Inst. of Microelectron., Tsinghua Univ., Beijing, China
Volume :
2
Issue :
2
fYear :
2012
Firstpage :
286
Lastpage :
293
Abstract :
Thermal management is one of the critical challenges in 3-D integration. The intermediate bonding interfaces between two chips, such as silicon dioxide and polymer adhesives, are the major source of internal thermal resistance in 3-D integrated circuits, leading to thermal issues such as high temperature spots and larger temperature gradients. This paper reports an approach to reduce the thermal resistance of a common bonding adhesive benzocyclobutene (BCB) by loading carbon nanotubes (CNTs) to improve the thermal conductivity. By exploiting the aromatic property of BCB, an ultrasonication-assisted noncovalent dispersion method is developed to disseminate CNTs with different concentrations into BCB. Thanks to the high thermal conduction ability of CNTs, the thermal conductivity of BCB is improved as much as 20% by loading 1.5 wt% CNTs. The surface temperature of bonded chips during heating are measured to evaluate the dynamic heat transfer ability, and a 13% improvement is achieved for BCB-CNT composites. The bonding strength of pure BCB and BCB-CNT composites are tested and the results show that CNTs is beneficial to improving the bonding strength.
Keywords :
adhesive bonding; carbon nanotubes; thermal conductivity; three-dimensional integrated circuits; 3D integrated circuit; 3D integration; adhesive bonding strength; aromatic property; benzocyclobutene; carbon nanotubes; dynamic heat transfer ability; high thermal conduction; intermediate bonding interface; internal thermal resistance; polymer adhesive; silicon dioxide; thermal conductivity enhancement; thermal management; ultrasonication-assisted noncovalent dispersion method; Conductivity; Dispersion; Heat transfer; Heating; Temperature measurement; Thermal resistance; 3-D integration; benzocyclobutene; bonding; carbon nanotube (CNT); thermal conductivity;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2011.2173345
Filename :
6085600
Link To Document :
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