Comparison of bondwire life with effective strain method and cohesive zone method for a power package

Author

Jicheng Zhang ; Yangjian Xu ; Yong Liu

Author_Institution

Fairchild -ZJUT Microelectron. Packaging Joint Lab., Zhejiang Univ. of Technol., Hangzhou, China

fYear

2014

fDate

7-9 April 2014

Firstpage

1

Lastpage

7

Abstract

In this paper, the cohesive zone model was used to simulate the stiffness degradation of interfaces between dies and solder joints in a power module. Subsequently, the fatigue life of the solder joints was predicted by the effective strain method. In addition, the cohesive zone model, collabrating with a modified paris´ law, was further utilized to investigate the reliability of a wirebond model. At the same time, the effect of the cohesive zone model parameters on the reliability was studied.

Keywords

electronics packaging; lead bonding; modules; reliability; solders; bondwire life; cohesive zone method; dies; effective strain method; modified Paris law; power module; power package; reliability; solder joints; stiffness degradation; wire bond model; Abstracts; Ceramics; Copper; Electromagnetic compatibility; Equations; Reliability; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on

Conference_Location

Ghent

Print_ISBN

978-1-4799-4791-1

Type

conf

DOI

10.1109/EuroSimE.2014.6813798

Filename

6813798