Title :
Design, technology, numerical simulation and optimization of building blocks of a micro and nano scale tensile testing platform with focus on a piezoresistive force sensor
Author :
Meszmer, Peter ; Hiller, K. ; May, Dominik ; Hartmann, Steve ; Shaporin, A. ; Mehner, J. ; Wunderle, B.
Author_Institution :
Fac. for Electr. Eng. & Inf. Technol., Tech. Univ. Chemnitz, Chemnitz, Germany
Abstract :
In this paper, building blocks of a MEMS tensile testing platform are presented. The building blocks include a thermo-mechanical MEMS actuator, driven by an aluminum thin-film heater on a thermal oxide for electrical insulation, a capacitative displacement sensor and a piezoresistive force sensor, capable of measuring forces on a nano-newton scale. It is shown, that the presented building blocks fulfill the requirements for the use in a tensile loading stage for thermo-mechanical material characterization of one dimensional material samples on a micro- and nanoscopic scale under different environmental conditions, as varying temperatures, pressure, moisture. All components are realized in BDRIE technology, following a specimen centered approach. In extension to previous presented actuators and sensors, the authors are aiming for high flexibility and full integratability of all components on the wafer-level and require for all building blocks the capability of electrical drive and electrical in situ readout, respectively.
Keywords :
aluminium; electric drives; force measurement; force sensors; microactuators; microsensors; nanosensors; optimisation; piezoresistive devices; tensile testing; thermal insulation; thermomechanical treatment; thin film sensors; wafer level packaging; Al; BDRIE technology; MEMS tensile testing; aluminum thin film heater; building blocks; capacitative displacement sensor; electrical drive; electrical in situ readout; electrical insulation; environmental conditions; force measurement; micro scale tensile testing; nano scale tensile testing; nano-Newton scale; numerical simulation; one dimensional material samples; optimization; piezoresistive force sensor; specimen centered approach; tensile loading stage; thermal oxide; thermomechanical MEMS actuator; thermomechanical material characterization; wafer level; Abstracts; Actuators; Force; Micromechanical devices; Microscopy; Reliability; Resistance heating;
Conference_Titel :
Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on
Conference_Location :
Ghent
Print_ISBN :
978-1-4799-4791-1
DOI :
10.1109/EuroSimE.2014.6813843