DocumentCode
1382205
Title
Foreword thermal investigations of ICs and systems (THERMINIC)
Author
Courtois, B.
Volume
23
Issue
3
fYear
2000
Firstpage
546
Lastpage
547
Keywords
Accuracy; Assembly; Components, packaging, and manufacturing technology; Conferences; Heat transfer; Microelectronics; Packaging; Paper technology; Temperature; Testing;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2000.868856
Filename
868856
Link To Document