Accurate prediction of SnAgCu solder joint fatigue of QFP packages for thermal cycling

Author

Niessner, M. ; Schuetz, G. ; Birzer, C. ; Preu, H. ; Weiss, L.

Author_Institution

Infineon Technol. AG, Munich, Germany

fYear

2014

fDate

7-9 April 2014

Firstpage

1

Lastpage

6

Abstract

We present an approach for the accurate prediction of the solder joint fatigue of quad flat packages (QFPs) with gullwing-shaped leads exposed to thermal cycling on board (TCoB). The derived fatigue life model is experimentally validated against more than 25 legs that differ in package size, materials, thermal cycling temperature profile and exposed pad vs. non-exposed pad type. The fatigue life model shows an accuracy of 25% and is used to analyze the sensitivity of the solder joint lifetime of QFPs w.r.t. changes in material properties and geometry.

Keywords

copper alloys; electronics packaging; fatigue; silver alloys; solders; tin alloys; QFP packages; SnAgCu; SnAgCu solder joint fatigue; TCoB; fatigue life; gullwing-shaped leads; material geometry; material properties; quad flat packages; solder joint lifetime; thermal cycling on board; thermal cycling temperature profile; Abstracts; Copper; Electromagnetic compatibility; Geometry; Heating; ISO; Time measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on

Conference_Location

Ghent

Print_ISBN

978-1-4799-4791-1

Type

conf

DOI

10.1109/EuroSimE.2014.6813873

Filename

6813873