DocumentCode
138243
Title
Assessment of microelectronics interconnect reliability - current practice and trends
Author
Borgesen, P.
Author_Institution
Dept. of Syst. Sci. & Ind. Eng., Binghamton Univ., Binghamton, NY, USA
fYear
2014
fDate
7-9 April 2014
Firstpage
1
Lastpage
5
Abstract
When it comes to the long-term reliability of the most common microelectronics interconnects, too little effort is spent on investigating important aspects while a significant amount of day-to-day reliability testing may be more or less wasted. This would seem to be at least partially so because reliability managers often fail to ask themselves what it is that they really want to know. Notably, while rarely explicitly recognized even ongoing `engineering tests´ will usually be meaningless unless they reveal something about relative performance in service. This requires a model or at least a quantitative mechanistic understanding.
Keywords
integrated circuit interconnections; integrated circuit reliability; day-to-day reliability testing; engineering tests; long-term reliability; microelectronics interconnect reliability assessment; Market research; Reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on
Conference_Location
Ghent
Print_ISBN
978-1-4799-4791-1
Type
conf
DOI
10.1109/EuroSimE.2014.6813880
Filename
6813880
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