Title :
CAVET on Bulk GaN Substrates Achieved With MBE-Regrown AlGaN/GaN Layers to Suppress Dispersion
Author :
Chowdhury, Srabanti ; Wong, Man Hoi ; Swenson, Brian L. ; Mishra, Umesh K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of California, Santa Barbara, CA, USA
Abstract :
A current aperture vertical electron transistor (CAVET) with a Mg-ion-implanted current blocking layer (CBL) and a channel regrown by plasma assisted molecular beam epitaxy (MBE), is successfully demonstrated on bulk GaN to work as a high voltage device. The fabrication of the device combined a drift region grown by metalorganic chemical vapor deposition (MOCVD), to hold the blocking voltage, with AlGaN/GaN layers regrown by plasma-MBE to conduct current. The device registered a maximum current of 4 kA· cm-2 under direct-current operation offering a specific on-state resistance Ron - A of 2.2 mΩ·cm2. With 80 μs pulses applied to the gate, the devices showed no dispersion. The increased aperture length Lap resulted in the decrease in specific Ron, as expected. The impact of the gate overlap to aperture Lgo on the leakage current was studied, where the leakage current was found to increase with a smaller overlap.
Keywords :
MOCVD; aluminium compounds; gallium compounds; leakage currents; molecular beam epitaxial growth; semiconductor growth; transistors; AlGaN-GaN; CAVET; GaN; MOCVD; Mg-ion-implanted CBL; Mg-ion-implanted current blocking layer; current aperture vertical electron transistor; dispersion suppression; leakage current; metalorganic chemical vapor deposition; plasma assisted MBE regrown; plasma assisted molecular beam epitaxy regrown; time 80 mus; Aluminum gallium nitride; Apertures; Electric breakdown; Gallium nitride; Logic gates; Silicon; Substrates; AlGaN/GaN; Mg-implanted; current-aperture vertical electron transistor (CAVET); plasma-MBE;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2011.2173456