DocumentCode
1387686
Title
Thickness Effect on the Structural and Electrical Properties of Sputtered YBCO Coated Conductors
Author
Tao, Bowan ; Zhang, Ning ; Zhang, Fei ; Xia, Yudong ; Feng, Xiao ; Xue, Yan ; Zhao, Xiaohui ; Xiong, Jie ; Li, Yanrong
Author_Institution
State Key Lab. of Electron. Thin Film & In tegrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Volume
21
Issue
3
fYear
2011
fDate
6/1/2011 12:00:00 AM
Firstpage
2945
Lastpage
2948
Abstract
In this paper we studied the structural and electrical properties variations with the thickness of YBa2Cu3O7-X (YBCO) film. In our experiments, the critical current density (Jc) has a maximum at 1.2 micron rather than monotonically decreased with increasing film thickness. The in-plane and out-plane alignments of the films, measured with X-ray Diffraction Omega-scan and Phi-scan, were poor at the beginning stage of the deposition and then became better as the film thickness increased.The surfaces of different samples also change a lot while films less than 700 nm in thickness. Under optimized deposition conditions, biaxial textured YBCO films have been obtained, with the full width at half maximum being 2.1° and 4.5° for out-of-plane and in-plane orientations respectively, Jc greater than 1.2 MA/cm2 at 77 K, self field.
Keywords
X-ray diffraction; barium compounds; critical current density (superconductivity); high-temperature superconductors; sputter deposition; superconducting thin films; yttrium compounds; X-ray diffraction; YBCO; biaxial textured YBCO films; critical current density; electrical properties; film alignments; in-plane orientations; out-of-plane orientations; sputtered YBCO coated conductors; structural properties; temperature 77 K; thickness effect; Buffer layers; Conductors; Integrated circuits; Sputtering; Substrates; Surface treatment; Yttrium barium copper oxide; Electrical properties; YBCO; structural variation; thickness;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/TASC.2010.2090439
Filename
5643964
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