Temperature increment in high voltage copper conductor under various applied current waveforms

Temperature increment in high voltage copper conductors is one of the important parameters that needs to be monitored continuously. This is due to significant temperature rise in the conductor may lead to thermal breakdown, which consequently causing power outage. One of the factors affecting temperature rise in conductors is the applied voltage waveform. In this work, simulation of temperature increment in high voltage conductors under different applied voltage waveform was performed using finite element analysis (FEA) software. From the simulation results, applied voltage waveform which yields the highest temperature increment in high voltage conductors can be identified, which are DC and square waveforms. Triangular waveform yields the lowest temperature increment in the conductor. The results from this work may increase an understanding about heat transfer under different applied current or voltage waveform.