DocumentCode
1391017
Title
Abstracts of forthcoming manuscripts
Volume
23
Issue
3
fYear
2000
fDate
7/1/2000 12:00:00 AM
Firstpage
154
Lastpage
156
Abstract
Provides an abstract of articles to be presented in a forthcoming issue.
fLanguage
English
Journal_Title
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/TEPM.2000.873241
Filename
873241
Link To Document