• DocumentCode
    139236
  • Title

    High correlation of double Debye model parameters in skin cancer detection

  • Author

    Truong, Bao C. Q. ; Tuan, H.D. ; Fitzgerald, Anthony J. ; Wallace, Vincent P. ; Nguyen, Hung T.

  • Author_Institution
    Centre for Health Technol., Univ. of Technol. Sydney, Ultimo, NSW, Australia
  • fYear
    2014
  • fDate
    26-30 Aug. 2014
  • Firstpage
    718
  • Lastpage
    721
  • Abstract
    The double Debye model can be used to capture the dielectric response of human skin in terahertz regime due to high water content in the tissue. The increased water proportion is widely considered as a biomarker of carcinogenesis, which gives rise of using this model in skin cancer detection. Therefore, the goal of this paper is to provide a specific analysis of the double Debye parameters in terms of non-melanoma skin cancer classification. Pearson correlation is applied to investigate the sensitivity of these parameters and their combinations to the variation in tumor percentage of skin samples. The most sensitive parameters are then assessed by using the receiver operating characteristic (ROC) plot to confirm their potential of classifying tumor from normal skin. Our positive outcomes support further steps to clinical application of terahertz imaging in skin cancer delineation.
  • Keywords
    cancer; image classification; medical image processing; sensitivity analysis; skin; tumours; Pearson correlation; ROC; biological tissue; biomarker; carcinogenesis; clinical application; dielectric response; double Debye model parameters; high-water content; human skin; nonmelanoma skin cancer classification; receiver operating characteristics; skin cancer delineation; skin cancer detection; skin samples; terahertz imaging; terahertz regime; tumor classification; tumor percentage; water proportion; Absorption; Correlation; Imaging; Sensitivity; Skin; Skin cancer; Tumors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2014.6943691
  • Filename
    6943691