• DocumentCode
    1394331
  • Title

    The Effect of Layout Topology on Single-Event Transient Pulse Quenching in a 65 nm Bulk CMOS Process

  • Author

    Ahlbin, J.R. ; Gadlage, M.J. ; Ball, D.R. ; Witulski, A.W. ; Bhuva, B.L. ; Reed, R.A. ; Vizkelethy, G. ; Massengill, L.W.

  • Author_Institution
    Vanderbilt Univ., Nashville, TN, USA
  • Volume
    57
  • Issue
    6
  • fYear
    2010
  • Firstpage
    3380
  • Lastpage
    3385
  • Abstract
    Heavy-ion microbeam and broadbeam data are presented for a 65 nm bulk CMOS process showing the existence of pulse quenching at normal and angular incidence for designs where the pMOS transistors are in common n-wells or isolated in separate n-wells. Experimental data and simulations show that pulse quenching is more prevalent in the common n-well design than the separate n-well design, leading to significantly reduced SET pulsewidths and SET cross-section in the common n-well design.
  • Keywords
    CMOS integrated circuits; nuclear electronics; CMOS process; heavy-ion broadbeam data; heavy-ion microbeam data; layout topology effect; n-well design; pMOS transistor; single-event transient cross-section; single-event transient pulse quenching; CMOS technology; Integrated circuit layout; Single event transient; Single event upset; Charge sharing; pulse quenching; single-event; single-event transient (SET); single-event upset;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.2010.2085449
  • Filename
    5657994