Title :
Design of Digital Circuits Using Inverse-Mode Cascode SiGe HBTs for Single Event Upset Mitigation
Author :
Thrivikraman, Tushar K. ; Wilcox, Edward ; Phillips, Stanley D. ; Cressler, John D. ; Marshall, Cheryl ; Vizkelethy, Gyorgy ; Dodd, Paul ; Marshall, Paul
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
We report on the design and measured results of a new SiGe HBT radiation hardening by design technique called the “inverse-mode cascode” (IMC). A third-generation SiGe HBT IMC device was tested in a time resolved ion beam induced charge collection (TRIBICC) system, and was found to have over a 75% reduction in peak current transients with the use of an n-Tiedown on the IMC sub-collector node. Digital shift registers in a 1st-generation SiGe HBT technology were designed and measured under a heavy-ion beam, and shown to increase the LET threshold over standard npn only shift registers. Using the CREME96 tool, the expected orbital bit-errors/day were simulated to be approximately 70% lower with the IMC shift register. These measured results help demonstrate the efficacy of using the IMC device as a low-cost means for improving the SEE radiation hardness of SiGe HBT technology without increasing area or power.
Keywords :
BiCMOS digital integrated circuits; Ge-Si alloys; heterojunction bipolar transistors; radiation hardening; semiconductor device models; semiconductor materials; shift registers; IMC subcollector node; SiGe HBT IMC device; SiGe HBT radiation hardening; SiGe HBT technology; TRIBICC system; digital circuit design; digital shift registers; heavy-ion beam; inverse-mode cascode; n-Tiedown; peak current transients; single event upset mitigation; time resolved ion beam induced charge collection; Digital circuits; Heterojunction bipolar transistors; Radiation hardening; Silicon germanium; Digital circuits; heterojunction bipolar transistors; radiation hardening; silicon germanium;
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.2010.2074214