DocumentCode :
1394589
Title :
Fully coupled dynamic electro-thermal simulation
Author :
Digele, Georg ; Lindenkreuz, Steffi ; Kasper, Erich
Author_Institution :
Inst. of Semicond. Eng., Stuttgart Univ., Germany
Volume :
5
Issue :
3
fYear :
1997
Firstpage :
250
Lastpage :
257
Abstract :
Fully coupled dynamic electro-thermal simulation on chip and circuit level is presented. Temperature dependent thermal conductivity of silicon is taken into account, thus solving the nonlinear heat diffusion equation. The numerical solution is carried out by using the industry-standard simulator SABER, therefore for electro-thermal simulations we are able to use the common electrical compact models by adding a heat source and thermal pins to them. The application of this technique and need for electro-thermal simulation is illustrated with the simulation of a current control circuit built into a multiwatt package.
Keywords :
VLSI; circuit analysis computing; digital simulation; integrated circuit design; integrated circuit modelling; integrated circuit packaging; thermal conductivity; thermal diffusion; SABER; VLSI; current control circuit; dynamic electro-thermal simulation; electrical compact models; industry-standard simulator; multiwatt package; nonlinear heat diffusion equation; temperature dependent thermal conductivity; Circuit simulation; Coupling circuits; Electric current control; Nonlinear equations; Packaging; Pins; Resistance heating; Silicon; Temperature dependence; Thermal conductivity;
fLanguage :
English
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
1063-8210
Type :
jour
DOI :
10.1109/92.609867
Filename :
609867
Link To Document :
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