DocumentCode
139574
Title
A software platform for the comparative analysis of electroanatomic and imaging data including conduction velocity mapping
Author
Cantwell, Chris D. ; Roney, Caroline H. ; Ali, Rheeda L. ; Qureshi, Norman A. ; Phang Boon Lim ; Peters, Nicholas S.
Author_Institution
Nat. Heart & Lung Inst., Imperial Coll. London, London, UK
fYear
2014
fDate
26-30 Aug. 2014
Firstpage
1591
Lastpage
1594
Abstract
Electroanatomic mapping systems collect increasingly large quantities of spatially-distributed electrical data which may be potentially further scrutinized post-operatively to expose mechanistic properties which sustain and perpetuate atrial fibrillation. We describe a modular software platform, developed to post-process and rapidly analyse data exported from electroanatomic mapping systems using a range of existing and novel algorithms. Imaging data highlighting regions of scar can also be overlaid for comparison. In particular, we describe the conduction velocity (CV) mapping algorithm used to highlight wavefront behaviour. CV was found to be particularly sensitive to the spatial distribution of the triangulation points and corresponding activation times. A set of geometric conditions were devised for selecting suitable triangulations of the electrogram set for generating CV maps.
Keywords
bioelectric phenomena; medical disorders; medical image processing; CV maps; activation times; atrial fibrillation; comparative analysis; conduction velocity mapping algorithm; electroanatomic data; electroanatomic mapping systems; electrogram set; geometric conditions; imaging data; mechanistic properties; modular software platform; post-process; spatial distribution; spatially-distributed electrical data; triangulation points; wavefront behaviour; Algorithm design and analysis; Imaging; Measurement errors; Software; Software algorithms; Three-dimensional displays; Vectors;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location
Chicago, IL
ISSN
1557-170X
Type
conf
DOI
10.1109/EMBC.2014.6943908
Filename
6943908
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